Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent
1997-08-22
1998-08-11
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
357787, 357790, 357793, 357706, 438 15, 438106, 438127, H01L 2329, H01L 2328, H01L 2310, H01L 2334
Patent
active
057931186
ABSTRACT:
In a method of manufacturing a semiconductor device including a semiconductor element and a chip carrier which has conductive leads bonded to the semiconductor element, a first resin mold portion is formed by a first resin mold portion to locate inner parts of the conductive leads together with the semiconductor element within the first resin mold portion. Thereafter, a second resin mold portion is formed to cover the first resin mold portion on a side of the semiconductor element and to uncover the first resin mold portion on another side opposite to the semiconductor element. Alternatively, a heat spreader may be attached to the semiconductor element and may be sealed by the first and the second resin mold portions.
REFERENCES:
patent: 4026008 (1977-05-01), Drees et al.
patent: 5083191 (1992-01-01), Ueda
patent: 5090609 (1992-02-01), Nakao et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5345106 (1994-09-01), Doering et al.
Clark Jhihan B.
NEC Corporation
Saadat Mahshid D.
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