Method of supporting wiring design, supporting apparatus...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C716S030000

Reexamination Certificate

active

11075705

ABSTRACT:
A supporting apparatus includes a first setting unit which sets an initial shape of the linear structure, a providing unit which provides a finite element model of the linear structure, a second setting unit which sets a physical property and restriction conditions to the finite element model, a calculating unit which calculates a predictive shape of the finite element model which is in a physically balanced condition based on the physical property and the restriction conditions, and an outputting unit which outputs a calculation result of the calculating process of the predictive shape. The calculating unit calculates a first predictive shape in which a forced displacement destination of a first control point on the finite element model is set as the restriction conditions, and calculates a second predictive shape in which a forced displacement destination of a second control point on the finite element model is set as the restriction conditions.

REFERENCES:
patent: 7124069 (2006-10-01), Meuris et al.
patent: 7133810 (2006-11-01), Butler et al.
patent: 7206723 (2007-04-01), Sawai et al.
patent: 2004/0172151 (2004-09-01), Sawai et al.
patent: 2004-139570 (2004-05-01), None
patent: 2004-139974 (2004-05-01), None
“Matrix Finite Element Method”, B. Nath, translated by Takashi Yokoyama, Aug. 10, 1978; Brain Books Publication Co., Ltd., pp. 7-15.
“Mode Analysis and Dynamic Design”, Kimihiko Yasuda, issued by the Corona Publishing Co., Ltd., Nov. 10, 1993.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of supporting wiring design, supporting apparatus... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of supporting wiring design, supporting apparatus..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of supporting wiring design, supporting apparatus... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3916969

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.