Low temperature texturing layer to enhance adhesion of...

Details Low temperature texturing layer to enhance adhesion of... Low temperature texturing layer to enhance adhesion of...

2008-01-01

2008-01-01

Toledo, Fernando L. (Department: 2823)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C438S118000, C257S466000

Reexamination Certificate

active

11097443

ABSTRACT:
A method of forming a film on a substrate. In accordance with the invention, an adhesion layer is formed on the substrate. The adhesion layer is chemically bonded to the substrate and has a textured surface. The film is then formed on the textured surface of the adhesion layer.

REFERENCES:
patent: 6472014 (2002-10-01), Matsuba

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