Plasma CVD apparatus for forming uniform film

Details Plasma CVD apparatus for forming uniform film Plasma CVD apparatus for forming uniform film

2008-09-02

2008-09-02

Ghyka, Alexander G (Department: 2812)

Coating apparatus

Gas or vapor deposition

With treating means

C118S728000, C118S7230MW, C156S345470, C156S345510, C438S680000

Reexamination Certificate

active

11202492

ABSTRACT:
A plasma CVD film formation apparatus includes: a reaction chamber; a shower plate installed inside the reaction chamber; and a susceptor for placing a wafer thereon installed substantially parallel to and facing the shower plate. The shower plate has a surface facing the susceptor, which is configured using a convex shape toward a center as a basic shape and overlaying at least one equation thereon, and the susceptor supports the wafer at a peripheral portion and at a position between a central portion and the peripheral portion.

REFERENCES:
patent: 6631692 (2003-10-01), Matsuki et al.
patent: 6692576 (2004-02-01), Halpin et al.
patent: 3207147 (2001-07-01), None
Naoto Tsuji, et al., Plasma CVD Film-Forming Device, Invention Association Publication No. 2002-1338, issued Mar. 1, 2002, p. 1-2.

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