Enhanced sampling methodology for semiconductor processing

Details Enhanced sampling methodology for semiconductor processing Enhanced sampling methodology for semiconductor processing

2007-10-16

2007-10-16

Karlsen, Ernest (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C702S084000, C716S030000

Reexamination Certificate

active

11268236

ABSTRACT:
The present invention improves wafer sampling methods by partitioning a semiconductor wafer into a set of sampling regions and calculating yield of a sampling region(s) of the semiconductor wafer.

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