Healing algorithm

Details Healing algorithm Healing algorithm

2007-10-02

2007-10-02

Chiang, Jack (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

10937737

ABSTRACT:
An aspect of the present invention includes a method for reshaping sub-objects in at least one object in pattern design data to be presented to a mask writer or a direct writer for producing a pattern onto a workpiece, where said object comprises a plurality of slivers in a first direction, comprising the actions of: a) generating a list of slivers, repeating the actions of: b) comparing a dynamic object in an object list with the slivers in said list of slivers to look for adjacent slivers, c) removing adjacent slivers from said list of slivers to said object list, d) merging adjacent slivers with said dynamic object, e) terminating the repetition when no slivers in said list of slivers are adjacent to said dynamic object in said object list. Other aspects of the present invention are reflected in the detailed description, figures and claims.

REFERENCES:
patent: 4933889 (1990-06-01), Meshkat et al.
patent: 5812412 (1998-09-01), Moriizumi et al.
patent: 6813757 (2004-11-01), Aton et al.
patent: 7010776 (2006-03-01), Gallatin et al.

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