Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-08-28
2007-08-28
Wu, Jingge (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
Reexamination Certificate
active
10637488
ABSTRACT:
A pattern inspecting method and apparatus for inspecting a defect or defective candidate of patterns on a sample includes picking up an image of a sample by shifting a sampling position on the sample, measuring geometric distortion in an image of a standard sample, beforehand, and defining a size for which the measured geometric distortion is neglectable, obtaining a first image of the sample and a second image to be compared with the first image, dividing the first image and the second stage into images of a division unit having a size not greater than the defined size, comparing a divided image of the first image with a divided image of the second image, and for calculating a difference in gradation values between both of the divided images. The defect or the defect candidate of the sample is extracted in accordance with the difference in the gradation values.
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Doi Hideaki
Hiroi Takashi
Maeda Shuji
Ninomiya Takanori
Shishido Chie
Antonelli, Terry Stout and Kraus, LLP.
Hitachi , Ltd.
Lu Tom Y.
Wu Jingge
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