Photosensitive resin, photoresist composition having the...

Details Photosensitive resin, photoresist composition having the... Photosensitive resin, photoresist composition having the...

2007-08-21

2007-08-21

Schilling, Richard L. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C430S905000, C430S910000, C430S914000

Reexamination Certificate

active

11333934

ABSTRACT:
In a photosensitive resin, a photoresist composition having the photosensitive resin, and a method of forming a photoresist pattern by using the photoresist, the photosensitive resin includes a blocking group substituted for an acid. The photosensitive resin has a weight-average molecular weight of from about 6,000 up to about 8,000. The photosensitive resin has a blocking ratio of from about 5% up to about 40%.

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patent: 2002-221795 (2002-08-01), None
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English language abstract of Korean Publication No. 2001-0089151.
English language abstract of Japanese Publication No. 2002-221795.
English language abstract of Japanese Publication No. 2004-212975.

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