Method for making an integrated circuit substrate having...

Details Method for making an integrated circuit substrate having... Method for making an integrated circuit substrate having...

Filed on

2007-12-25

Date issued

2007-12-25

Examiner

Pham, Long (Department: 2814)

Patent Class

Semiconductor device manufacturing: process

SubClass

Packaging or treatment of packaged semiconductor

Other Related Categories

C438S108000, C438S622000

Type

Reexamination Certificate

Status

active

Patent number

11021977

Description

ABSTRACT:
A method for making an integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. A dielectric material is injection-molded or laminated over a metal layer that is punched or etched. The metal layer can provide one or more power planes within the substrate. A laser is used to ablate channels on the surfaces of the outer dielectric layer for the conductive patterns. The conductive patterns are electroplated or paste screen-printed and an etchant-resistive material is applied. Finally, a plating material can be added to exposed surfaces of the conductive patterns. An integrated circuit die and external terminals can then be attached to the substrate, providing an integrated circuit having a high-density interconnect.

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