Reflective mask useful for transferring a pattern using...

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Reexamination Certificate

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Reexamination Certificate

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10872057

ABSTRACT:
An EUV mask (10, 309) includes an opening (26) that helps to attenuate and phase shift extreme ultraviolet radiation using a subtractive rather than additive method. A first embedded layer (20) and a second embedded layer (21) may be provided between a lower multilayer reflective stack (14) and an upper multilayer reflective stack (22) to ensure an appropriate and accurate depth of the opening (26), while allowing for defect inspection of the EUV mask (10, 309) and optional defect repair. An optional ARC layer (400) may be deposited in region (28) to reduce the amount of reflection within dark region (28). Alternately, a single embedded layer of hafnium oxide, zirconium oxide, tantalum silicon oxide, tantalum oxide, or the like, may be used in place of embedded layers (20, 21). Optimal thicknesses and locations of the various layers are described.

REFERENCES:
patent: 6596465 (2003-07-01), Mangat
patent: 6641959 (2003-11-01), Yan
patent: 6653053 (2003-11-01), Mangat
patent: 6673520 (2004-01-01), Han
patent: 6905801 (2005-06-01), Liang et al.
patent: 6986971 (2006-01-01), Han et al.
patent: 7090948 (2006-08-01), Rau
Chovino et al., “EUV Mask Making: An Approach Based on the Direct Patterning of the EUV Reflector,” Proceedings of SPIE, vol. 5256, 23rdAnnual Bacus Symposium on Photomask Technology, 2003, pp. 566-572.
Han et al, “Development of Phase Shift Masks for Extreme Ultra Violet Lithography and Optical Evaluation of Phase Shift Materials.” Proc of SPIE vol. 5374, 2004, 10 pgs.
Deng et al., “Rigorous EM Simulation of the Influence of the Structure of Mask Patterns on EUVL Imaging,” Emerging Lithographic Technologies VII, Proceedings of SPIE vol. 5037, 2003, pp. 302-313.
Han et al., “Design and Method of Fabricating Phase Shift Masks for Extreme Ultraviolet Lithography by Partial Etching into the EUV Multilayer Mirror,” Emerging Lithographic Technologies VII, Proceedings of SPIE vol. 5037, 2003, pp. 314-330.

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