Photoresist undercoat-forming material and patterning process

Details Photoresist undercoat-forming material and patterning process Photoresist undercoat-forming material and patterning process

2007-12-04

2007-12-04

Lee, Sin (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S271100, C430S272100, C430S914000, C430S919000, C430S920000, C430S921000, C430S925000, C430S325000, C430S326000, C430S313000, C430S316000, C430S317000, C430S318000, C430S323000, C430S329000

Reexamination Certificate

active

10952834

ABSTRACT:
An undercoat-forming material comprising a novolak resin having a fluorene or tetrahydrospirobiindene structure, an organic solvent, an acid generator, and a crosslinker, optionally combined with an intermediate layer having an antireflective effect, has an absorptivity coefficient sufficient to provide an antireflective effect at a thickness of at least 200 nm and a high etching resistance as demonstrated by slow etching rates with CF4/CHF3and Cl2. BCl3gases for substrate processing.

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