Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2007-08-21
2007-08-21
Kunemund, Robert (Department: 1722)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S413000, C257S414000, C257S415000, C117S084000, C117S088000
Reexamination Certificate
active
10018180
ABSTRACT:
A micromechanical component includes: a substrate; a micromechanical functional plane provided on the substrate; a covering plane provided on the micromechanical functional plane; and a printed circuit trace plane provided on the covering plane. The covering plane includes a monocrystalline region which is epitaxially grown on an underlying monocrystalline region, and the covering plane includes a polycrystalline region which is epitaxially grown on an underlying polycrystalline starting layer at the same time.
REFERENCES:
patent: 5075253 (1991-12-01), Sliwa, Jr.
patent: 5929497 (1999-07-01), Chavan et al.
patent: 6067858 (2000-05-01), Clark et al.
patent: 6150275 (2000-11-01), Cho et al.
patent: 6187607 (2001-02-01), Offenberg et al.
patent: 6328794 (2001-12-01), Brouillette et al.
patent: 6689694 (2004-02-01), Cho et al.
patent: 6936491 (2005-08-01), Partridge et al.
patent: 6952041 (2005-10-01), Lutz et al.
patent: 7056757 (2006-06-01), Ayazi et al.
patent: 7068125 (2006-06-01), Lutz et al.
patent: 7075160 (2006-07-01), Partridge et al.
patent: 7102467 (2006-09-01), Lutz et al.
patent: 7153716 (2006-12-01), Ikegami
patent: 43 18 466 (1994-12-01), None
patent: 43 41 271 (1995-06-01), None
patent: 195 37 814 (1997-04-01), None
patent: 197 00 290 (1998-07-01), None
patent: 0 890 998 (1999-01-01), None
patent: 0 895 090 (1999-02-01), None
patent: WO97/04319 (1997-02-01), None
patent: WO98/23934 (1998-06-01), None
Wolf et al., Silicon Processing for the VLSI Era vol. 1: Processing Technology, Lattice Press, sunset Beach, CA, USA, pp. 1151-1156, 1986.
Gennissen PTJ et al. “Bipolar-compatible expitaxial poly for smart sensors: Stress minimization and applications.” Sensors and Actuators, Jul. 1, 1997, pp. 636 to 645.
Lutz Markus
Offenberg Michael
Kenyon & Kenyon LLP
Kunemund Robert
Rao G. Nagesh
Robert & Bosch GmbH
LandOfFree
Micromechanical component and corresponding production method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Micromechanical component and corresponding production method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micromechanical component and corresponding production method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3888862