Method of forming multilayer interconnection structure, and...

Details Method of forming multilayer interconnection structure, and... Method of forming multilayer interconnection structure, and...

2007-08-28

2007-08-28

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S774000

Reexamination Certificate

active

10875590

ABSTRACT:
Method of forming a multilayer interconnection structure that includes a contact hole for reliably connecting between layers, without damaging a substrate. A column shaped mask material is formed in a position for forming a contact hole using a resist, and an interlayer insulating film is applied to the whole surface of the substrate excluding the mask material. Then, the mask material is removed by a method such as peeling. As a result, a hole generated thereby is used as a contact hole.

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