Non-magnetic nickel powders and method for preparing the same

Details Non-magnetic nickel powders and method for preparing the same Non-magnetic nickel powders and method for preparing the same

2007-02-27

2007-02-27

Mai, Ngoclan T. (Department: 1742)

Specialized metallurgical processes, compositions for use therei

Compositions

Loose particulate mixture containing metal particles

C977S777000

Reexamination Certificate

active

10819917

ABSTRACT:
Provided are non-magnetic nickel powders and a method for preparing the same. The nickel powders have non-magnetic property and a HCP crystal structure. The method include (a) dispersing nickel powders with a FCC crystal structure in an organic solvent to prepare a starting material dispersion, and (b) heating the starting material dispersion to transform the nickel powders with the FCC crystal structure to the nickel powders with the HCP crystal structure. The nickel powders do not exhibit magnetic agglomeration phenomenon. Therefore, the pastes for inner electrode formation in various electronic devices, which contain the nickel powders of the present invention, can keep the well-dispersed state. Also, inner electrodes made of the nickel powders can have a low impedance value even at high frequency band.

REFERENCES:
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patent: 35 13 119 (1986-10-01), None
patent: 35 13 132 (1986-10-01), None
D.A. Papaconstantopoulos et al., “Ferromagnetism in Hexagonal-Close-Packed Elements”, Physical Review B, 1989, pp. 2526-2528, vol. 39, No. 4.
European Search Report issued by the European Patent Office on Jul. 22, 2004 in corresponding Application No. 04 25 2080.
Giovanni Carturan et al., “Hexagonal Close Packed Nickel Powder: Synthesis, Structural Characterization and Thermal Behavior,” Material Letters, North Holland Publishing Company, Amsterdam, NL, vol. 7, No. 1.2, Aug. 1988.
Carturan G. et al., “Hexagonal Close Packed Nickel Powder: Synthesis, Structural Characterization and Thermal Behavior”, Materials Letters, Aug. 1988, pp. 47-50, vol. 7, No. 1,2.
(Copy of Office Action issued by Chinese Patent Office on Sep. 2, 2005).

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