Semiconductor device and method of fabricating same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S336000, C257S344000, C257S348000, C257S349000, C257S350000, C257S351000, C257S352000, C257S353000, C257S354000, C257S372000, C257S373000, C257S389000, C257S394000, C257S408000

Reexamination Certificate

active

10682477

ABSTRACT:
A semiconductor device and a method of fabricating the same suppress a substrate floating effect without causing lowering of a degree of integration. The semiconductor device has a Silicon-On-Insulator structure which includes a semiconductor layer formed on an insulator, and has at least one MOSFET element. The MOSFET element includes a source region; a drain region which is opposed to the source region; a body region disposed between the source and drain regions; a gate region positioned on or close to a surface of the body region, so as to form an electrically conducting channel in the body region; and an extracting region being in contact with both of the body region and the source region. The extracting region has a conductivity type which is the same as a conductivity type of the body region and has a concentration higher than that of the body region.

REFERENCES:
patent: 5650354 (1997-07-01), Himi et al.
patent: 5985708 (1999-11-01), Nakagawa et al.
patent: 6159778 (2000-12-01), Kim
patent: 6303450 (2001-10-01), Park et al.
patent: 6429084 (2002-08-01), Park et al.
patent: 6429482 (2002-08-01), Culp et al.
patent: 6440788 (2002-08-01), Mandelman et al.
patent: 6452232 (2002-09-01), Adan
patent: 6541821 (2003-04-01), Krishnan et al.
patent: 6633066 (2003-10-01), Bae et al.
patent: 6730964 (2004-05-01), Horiuchi
patent: 6734500 (2004-05-01), Ebina
patent: 7041538 (2006-05-01), Ieong et al.
patent: 2002/0050614 (2002-05-01), Unnikrishnan
patent: 2002/0149058 (2002-10-01), Culp et al.
patent: 2002/0163036 (2002-11-01), Miura et al.
patent: 2002/0197810 (2002-12-01), Hanafi et al.
patent: 2003/0117151 (2003-06-01), Kunikiyo et al.
patent: 2003/0122164 (2003-07-01), Komatsu
patent: 2004/0043568 (2004-03-01), Kar et al.
patent: 2004/0075141 (2004-04-01), Maeda et al.
patent: 2004/0129979 (2004-07-01), Park et al.
patent: 2004/0198002 (2004-10-01), Murakami et al.
patent: 2005/0048732 (2005-03-01), Park et al.
patent: 2005/0051851 (2005-03-01), Chen et al.
patent: 2-144969 (1990-06-01), None
patent: 3-94471 (1991-04-01), None
patent: 4-116984 (1992-04-01), None
patent: 7-193248 (1995-07-01), None
patent: 11-74538 (1999-03-01), None
patent: 2001-53280 (2001-02-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method of fabricating same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of fabricating same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of fabricating same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3875173

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.