Method for mounting passive components on wafer

Details Method for mounting passive components on wafer Method for mounting passive components on wafer

2007-02-13

2007-02-13

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S615000, C438S617000

Reexamination Certificate

active

10944816

ABSTRACT:
A method for mounting a passive component on a wafer. A passivation layer is disposed on a wafer having at least one first metal pad and at least one second metal pad thereon, which substantially exposes the first and second metal pads. A capping layer is formed on the exposed first metal pad, and an under ball metallurgy (UBM) layer is formed on the exposed second metal pad. A photoresist pattern layer is formed overlying the wafer to cover the capping layer and the passivation layer and expose the UBM layer. A solder bump is formed on the exposed UBM layer. After the photoresist pattern layer and the capping layer are successively removed, a passive component is mounted on the wafer through the solder bump.

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patent: 7081404 (2006-07-01), Jan et al.
patent: 2003/0057559 (2003-03-01), Mis et al.
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