Method for processing a thin semiconductor substrate

Details Method for processing a thin semiconductor substrate Method for processing a thin semiconductor substrate

2007-12-11

2007-12-11

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S459000, C257S341000, C257S343000, C257SE21159

Reexamination Certificate

active

10954763

ABSTRACT:
A method for processing a semiconductor substrate less than 200 μm thick has been provided. The substrate has one or a plurality of semiconductor elements, which may be identical or different. The substrate is arranged onto a chuck during processing, the front side of the substrate facing the chuck. During processing, an electrically conductive film, for example, made of metal, may be applied on the rear side of the substrate. The film may serve as electrical contact, heat sink or mechanical stabilizer.

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