Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-08-14
2007-08-14
Nguyen, Tuan H. (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S613000
Reexamination Certificate
active
11589464
ABSTRACT:
A method for fabricating a semiconductor component includes the steps of providing a semiconductor die, forming a plurality of redistribution contacts on the die, forming a plurality of interconnect contacts on the redistribution contacts, and forming an insulating layer on the interconnect contacts while leaving the tip portions exposed. The method also includes the step of forming terminal contacts on the interconnect contacts, or alternately forming conductors in electrical communication with the interconnect contacts and then forming terminal contacts in electrical communication with the conductors.
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Farnworth Warren M.
Hiatt William M.
Sinha Nishant
Watkins Charles M.
Gratton Stephen A.
Nguyen Tuan H.
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