Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2007-10-23
2007-10-23
Wilczewski, Mary (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S021000, C438S113000, C438S458000, C438S464000
Reexamination Certificate
active
11273271
ABSTRACT:
A method of separating MEMS devices from a structure having a substrate, a sacrificial layer positioned on a front side of the substrate and a plurality of MEMS devices embedded in the sacrificial layer includes the step of securing a front handle wafer to the sacrificial layer. The substrate is etched from a back side to the sacrificial layer to define individual MEMS integrated circuits held together with the sacrificial layer. The front handle wafer is removed and the sacrificial layer is etched away to release the MEMS integrated circuits.
REFERENCES:
patent: 4822755 (1989-04-01), Hawkins et al.
patent: 5187007 (1993-02-01), Ebe et al.
patent: 5476566 (1995-12-01), Cavasin
patent: 5605489 (1997-02-01), Gale et al.
patent: 5622900 (1997-04-01), Smith
patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 5904546 (1999-05-01), Wood et al.
patent: 5923599 (1999-07-01), Kao et al.
patent: 5923995 (1999-07-01), Kao et al.
patent: 5972781 (1999-10-01), Wegleiter et al.
patent: 6010782 (2000-01-01), Uemura et al.
patent: 6025251 (2000-02-01), Jakowetz
patent: 6184109 (2001-02-01), Sasaki et al.
patent: 6245593 (2001-06-01), Yoshihara et al.
patent: 6297131 (2001-10-01), Yamada et al.
patent: 6320266 (2001-11-01), Hatchard et al.
patent: 6383833 (2002-05-01), Silverbrook
patent: 6425971 (2002-07-01), Silverbrook
patent: 6492195 (2002-12-01), Nakanishi et al.
patent: 6982184 (2006-01-01), Silverbrook
patent: 7063993 (2006-06-01), Silverbrook
patent: 19957111 (2000-05-01), None
patent: 0661737 (1995-07-01), None
patent: 07022358 (1995-01-01), None
patent: 08250454 (1996-09-01), None
patent: 08281954 (1996-10-01), None
patent: WO 01/43169 (2001-06-01), None
patent: WO 2001/85600 (2001-11-01), None
Toshiyoshi, H et al. “Chip Level Three-Dimensional Assembling of Microsystems” Proceedings of the SPIE, Design, Test and Microfabrication of MEMS and MOEMS, Mar. 30-Apr. 1, 1999, Paris, France, vol. 3680, No. Part ½, 1999, pp. 679-686, XP001058963 Bellingham, VA, US. ISSN: 0277-786X Section “2.2 Fabrication Process”p. 680; figures 2,3.
Duong Khanh
Silverbrook Research Pty Ltd
Wilczewski Mary
LandOfFree
Method of separating MEMS devices from a composite structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of separating MEMS devices from a composite structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of separating MEMS devices from a composite structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3870525