Low-K dielectric structure and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257S775000, C257SE23145

Reexamination Certificate

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10301957

ABSTRACT:
A low-k dielectric sacrificial material is formed within a microelectronic structure covered with a suitable porous or low density permeable material. At an appropriate time, the underlying sacrificial material is decomposed and diffused away through the overlying permeable material. As a result, at least one void is created, contributing to desirable dielectric characteristics.

REFERENCES:
patent: 5923074 (1999-07-01), Jeng
patent: 6100184 (2000-08-01), Zhao et al.
patent: 6165890 (2000-12-01), Kohl et al.
patent: 6413852 (2002-07-01), Grill et al.
patent: 6448177 (2002-09-01), Morrow et al.
patent: 6555467 (2003-04-01), Hsu et al.
patent: 6867125 (2005-03-01), Kloster et al.
patent: 2001/0030366 (2001-10-01), Nakano et al.
patent: 2002/0028575 (2002-03-01), Besling et al.
patent: 2002/0158337 (2002-10-01), Babich et al.
patent: 2003/0071355 (2003-04-01), Dubin et al.
patent: 2003/0111729 (2003-06-01), Leu et al.
patent: 2003/0186535 (2003-10-01), Wong et al.
patent: 2003/0203592 (2003-10-01), Kloster et al.
patent: 2003/0218253 (2003-11-01), Avanzino et al.
patent: 2004/0026786 (2004-02-01), Leu et al.
patent: 2004/0096592 (2004-05-01), Chebiam et al.
patent: 2004/0131829 (2004-07-01), Joseph et al.
Tetsuya Ueda et al., “A novel air gap integration scheme for multi-level interconnects using self-aligned via plugs”, 1998 Symposium on VLSI Technology—Digest of Technical Papers, Jun. 9-11, 1998, IEEE, pp. 46-47.
Paul A. Kohl et al, “Air-gaps in 0.3 / spl mu / m electrical interconnections”, IEEE Electron Device Letters, vol. 21, Issue 12, Dec. 2000, pp. 557-559.

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