Semiconductor memory device and method of manufacturing the...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S301000, C257S320000

Reexamination Certificate

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10806399

ABSTRACT:
A semiconductor memory device includes a first insulation film which is provided on the inner surface of a trench formed in a semiconductor substrate and has its top located above the surface of the semiconductor substrate. A diffusion layer is formed within the semiconductor substrate, surrounding the deep portion of the trench. A first conductive layer is filled in the trench. A gate electrode is provided on a gate insulation layer formed on the surface of the semiconductor substrate. Source/drain diffusion layers are formed in the surface of the semiconductor substrate and sandwich a channel region below the gate electrode. A second conductive layer extends on the first conductive layer, the first insulation layer, and one of the source/drain diffusion layers.

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patent: 5349218 (1994-09-01), Tadaki et al.
patent: 5998821 (1999-12-01), Hieda et al.
patent: 6207494 (2001-03-01), Graimann et al.
patent: 6693005 (2004-02-01), King
patent: 4-256359 (1992-09-01), None
patent: 5-67749 (1993-03-01), None
patent: 10-223860 (1998-08-01), None

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