Die package for connection to a substrate

Details Die package for connection to a substrate Die package for connection to a substrate

2007-08-07

2007-08-07

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C174S559000, C439S076100

Reexamination Certificate

active

10878000

ABSTRACT:
A die carrier for holding a die, such as a microdisplay die, may be electrically connected to a substrate by pressing the substrate against flexible, resilient leads of the die carrier. The package includes a housing and a shroud mounted to the housing. The substrate is inserted through a slot in the shroud and, within the shroud, engages against the flexible, resilient leads, thereby establishing an electrical contact.

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