4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Charley Takeshi Ogata

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Die package for connection to a substrate

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Die package for connection to a substrate

Electricity: conductors and insulators – Boxes and housings – With electrical device
Reexamination Certificate

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Semiconductor die package having mesh power and ground planes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2701499

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