Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
Reexamination Certificate
2007-06-26
2007-06-26
Smith, Zandra V. (Department: 2822)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Ion implantation of dopant into semiconductor region
C438S514000, C438S527000
Reexamination Certificate
active
10806247
ABSTRACT:
A semiconductor device is provided, which aims to reduce the standby power thereof by reducing the leak between a body and a drain with restraining the effect on a threshold voltage, in order to actualize the highly reliable semiconductor device. When extension regions are formed, an n-type impurity less diffusive than phosphorus (P+), for example, arsenic (As+) is used as an impurity. In addition to ordinary ion implantation with high dose (high concentration) and low acceleration energy, As+ions are implanted with low dose and high acceleration energy.
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Fujitsu Limited
Smith Zandra V.
Tran Thanh Y.
Westerman, Hattori, Daniels & Adrian , LLP.
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