Package stress management

Details Package stress management Package stress management

2007-02-20

2007-02-20

Baumeister, B. William (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S124000, C438S126000, C438S108000, C438S118000, C438S613000, C257SE21502, C257SE21503, C257SE21499

Reexamination Certificate

active

11282255

ABSTRACT:
Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in which the encapsulating material has a combination of a low coefficient of thermal expansion material and a high coefficient of thermal expansion material.

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