Highly heat-resistant, negative-type photosensitive resin...

Details Highly heat-resistant, negative-type photosensitive resin... Highly heat-resistant, negative-type photosensitive resin...

2007-10-16

2007-10-16

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S018000, C430S287100, C430S288100, C430S325000, C430S330000

Reexamination Certificate

active

10520417

ABSTRACT:
Disclosed is a negative type photosensitive resin composition comprising (A) a polyamide having a photopolymerizable unsaturated double bond, (B) a monomer having a photopolymerizable unsaturated double bond, (C) a photopolymerization initiator and (D) a melamine resin.

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