Method of making assemblies having stacked semiconductor chips

Details Method of making assemblies having stacked semiconductor chips Method of making assemblies having stacked semiconductor chips

2007-10-30

2007-10-30

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE23177

Reexamination Certificate

active

11156812

ABSTRACT:
A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surface for mounting to an external circuit. The first panel includes a non-overmolded microelectronic element mounted thereon. The microelectronic element having a rear face and a front face surface, wherein the front face surface confronts the obverse surface of the first panel. During manufacture the flexible sheet is folded to create a stacked microelectronic assembly such that the rear face of the first microelectronic assembly confronts and substantially contacts the obverse surface of the second panel. This results in the second panel being kept substantially flat during subsequent mounting to the external circuit.

REFERENCES:
patent: 6699730 (2004-03-01), Kim et al.
patent: 6884653 (2005-04-01), Larson
patent: 2003/0062614 (2003-04-01), Larson
patent: 2003/0137048 (2003-07-01), Cady et al.
patent: 2005/0041404 (2005-02-01), Cady et al.

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