Method for fabricating micro-mechanical devices

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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C438S052000

Reexamination Certificate

active

11014415

ABSTRACT:
A method of fabricating micro-mechanical devices. A mesa is etched in a homogeneous wafer. The wafer is bonded to a patterned substrate with the mesa defining device elements suspended above the substrate. A portion of the wafer is removed until a desired device thickness is achieved. Discrete elements of the device are then formed by performing a structural etch on the remaining wafer material.

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