Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2007-02-20
2007-02-20
Mai, Anh D. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S758000, C257S087000, C257S103000, C438S132000, C438S601000
Reexamination Certificate
active
10845048
ABSTRACT:
Integrated circuit devices are provided including an integrated circuit substrate and first through fourth spaced apart lower interconnects on the integrated circuit substrate. The third and fourth spaced apart lower interconnects are parallel to the first and second lower interconnects. A first fuse is provided on the first and second lower interconnects between the first and second lower interconnects and is electrically coupled to the first and second lower interconnects. A second fuse is provided spaced apart from the first fuse and on the third and fourth lower interconnects. The second fuse is between the third and fourth lower interconnects and is electrically coupled to the third and fourth lower interconnects. Related methods of fabricating integrated circuit devices are also provided.
REFERENCES:
patent: 5618750 (1997-04-01), Fukuhara et al.
patent: 5760453 (1998-06-01), Chen
patent: 6054339 (2000-04-01), Gilmour et al.
patent: 6100118 (2000-08-01), Shih et al.
patent: 6444544 (2002-09-01), Hu et al.
patent: 6509255 (2003-01-01), Minn et al.
patent: 6521971 (2003-02-01), Tsai
patent: 6525398 (2003-02-01), Kim et al.
patent: 6531757 (2003-03-01), Shiratake
patent: 6566735 (2003-05-01), Minn et al.
patent: 6897110 (2005-05-01), He et al.
Taiwan Intellectual Property Office, “Preliminary Notice of the First Office Action” corresponding to Taiwan Patent application 93116292, mailed Sep. 15, 2005.
Byun Gwang-Seon
Cho Tai-Heui
Kang Hyuck-Jin
Kim Sun-Joon
Shin Heui-Won
Kunzer Brian E.
Mai Anh D.
Myers Bigel & Sibley & Sajovec
Samsung Electronics Co,. Ltd.
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