Die attaching method of semiconductor chip using warpage...

Details Die attaching method of semiconductor chip using warpage... Die attaching method of semiconductor chip using warpage...

2007-08-28

2007-08-28

Sarkar, Asok Kumar (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C257SE21237

Reexamination Certificate

active

11045078

ABSTRACT:
A die attaching method of a semiconductor chip simplifies the process of fabricating a package from the chip while preventing the chip form being damaged even when the chip is very thin. Warpage prevention material is adhered to a top surface of a wafer having a plurality of chips formed thereon, and then the wafer is cut to separate the chips from one another. Each semiconductor chip is then placed on and attached to a die pad of a base frame, while the warpage prevention material is detached from the semiconductor chip. Thus, the warpage prevention material is removed without requiring a process that is extraneous to the die attaching process.

REFERENCES:
patent: 6436795 (2002-08-01), Noguchi et al.
patent: 2004/0097054 (2004-05-01), Abe
patent: 2001-135598 (2001-05-01), None
patent: 2003-0095351 (2003-12-01), None

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