Semiconductor device having transferred integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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Details

C257S533000, C257S783000, C257S068000, C257S072000

Reexamination Certificate

active

10740606

ABSTRACT:
It is an object to provide a semiconductor device integrating various elements without using a semiconductor substrate, and a method of manufacturing the same. According to the present invention, a layer to be separated including an inductor, a capacitor, a resistor element, a TFT element, an embedded wiring and the like, is formed over a substrate, separated from the substrate, and transferred onto a circuit board100. An electrical conduction with a wiring pattern114provided in the circuit board100is made by a wire112or a solder107, thereby forming a high frequency module or the like.

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