Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2007-02-20
2007-02-20
Soward, Ida M. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S295000, C257S296000, C257S294000, C257S298000, C257S299000, C257S300000, C257S301000, C257S302000, C257S303000, C257S304000, C257S305000, C257S306000, C257S307000, C257S308000, C257S309000, C257S311000, C257S312000, C257S313000
Reexamination Certificate
active
10823797
ABSTRACT:
A semiconductor device includes a first hydrogen barrier film, a capacitor device formed on the first hydrogen barrier film, and a second hydrogen barrier film formed to cover the capacitor device. The first and second hydrogen barrier films each contain at least one common type of atoms for allowing the first and second hydrogen barrier films to adhere to each other.
REFERENCES:
patent: 6211035 (2001-04-01), Moise et al.
patent: 6316275 (2001-11-01), Hopfner
patent: 6395612 (2002-05-01), Amanuma
patent: 6509601 (2003-01-01), Lee et al.
patent: 6611014 (2003-08-01), Kanaya et al.
patent: 6611449 (2003-08-01), Hilliger
patent: 6664578 (2003-12-01), Lee et al.
patent: 6730951 (2004-05-01), Nagano et al.
patent: 6781184 (2004-08-01), Solayappan et al.
patent: 6900095 (2005-05-01), Yoon
patent: 6958508 (2005-10-01), Mikawa
patent: 6982444 (2006-01-01), Kanaya et al.
patent: 2003/0006439 (2003-01-01), Bailey
patent: 2004/0101977 (2004-05-01), Celinska et al.
patent: 1 298 730 (2003-04-01), None
patent: 1298730 (2003-04-01), None
patent: 11-8355 (1999-01-01), None
patent: 11-126881 (1999-05-01), None
patent: 11-135736 (1999-05-01), None
patent: P3098474 (2000-08-01), None
patent: 2001-7303 (2001-01-01), None
patent: 2001-237393 (2001-08-01), None
patent: 2002-110931 (2002-04-01), None
patent: 2003-68987 (2003-03-01), None
patent: 2003-086771 (2003-03-01), None
patent: 2003-224209 (2003-08-01), None
Judai Yuji
Kutsunai Toshie
Mikawa Takumi
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
Soward Ida M.
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