Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2007-12-11
2007-12-11
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257SE23002
Reexamination Certificate
active
10175141
ABSTRACT:
An IC chip bonding sheet having adhesive resin layers formed on both faces of a porous polytetrafluoroethylene layer comprising a porous polytetrafluoroethylene sheet, the porous polytetrafluoroethylene layer retaining porous voids, and the adhesive resin layers comprising a bromine-free flame retardant resin composition.
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Ohashi Kazuhiko
Yokomizo Osamu
Yoshida Koji
Japan Gore-Tex Inc.
Wheatcraft Allan M.
Zarneke David A.
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