Photosensitive resin composition and coating film cured...

Details Photosensitive resin composition and coating film cured... Photosensitive resin composition and coating film cured...

2007-06-19

2007-06-19

Lee, Sin (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S286100, C430S907000, C430S916000, C430S281100, C430S280100, C430S009000

Reexamination Certificate

active

11219869

ABSTRACT:
A photosensitive resin composition comprising a resin (A1) having fluorine atom-containing groups, silicon atom-containing groups and ethylenic double bonds, a radical initiator (B) and an alkali-soluble photosensitive resin (D) having at least three ethylenic double bonds per molecule. Further, a photosensitive resin composition comprising a resin (A2) having fluorine atom-containing groups and ethylenic double bonds, a resin (A3) having silicon atom-containing groups and ethylenic double bonds, a radical initiator (B), and an alkali-soluble photosensitive resin (D) having at least three ethylenic double bonds per molecule.

REFERENCES:
patent: 2005/0191580 (2005-09-01), Takahashi et al.
patent: 4-194941 (1992-07-01), None
patent: 7-35915 (1995-02-01), None
patent: 08-176504 (1996-07-01), None
patent: 11-279243 (1999-10-01), None
patent: 11-281815 (1999-10-01), None
patent: 2000-298339 (2000-10-01), None
patent: 2001-288216 (2001-10-01), None

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