Platen and head rotation rates for monitoring chemical...

Details Platen and head rotation rates for monitoring chemical... Platen and head rotation rates for monitoring chemical...

2007-06-05

2007-06-05

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S011000, C451S041000, C700S121000, C700S175000

Reexamination Certificate

active

11402522

ABSTRACT:
Methods system and apparatus, including computer program products, for monitoring polishing a substrate. A polishing pad mounted on a platen is rotated at a first rotation rate, and a carrier head is rotated at a second rotation rate that is different from the first rotation rate. The carrier head carries a substrate and presses the substrate against the polishing pad. A sequence of data traces is acquired using a sensor mounted in the platen, wherein each data trace results from a separate scan with the sensor along a path across the substrate, and wherein the first and second rotation rates are such that a plurality of paths corresponding to a predetermined number of consecutive scans are substantially evenly radially distributed across the substrate.

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