Method of flattening a crystallized semiconductor film...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S487000, C438S488000, C438S935000

Reexamination Certificate

active

10125529

ABSTRACT:
First laser light is irradiated (energy density of 400 to 500 mj/cm2) to a semiconductor film102in an atmosphere containing oxygen in order to obtain a semiconductor film102bhaving large depressions and projections on the surface. Then, an oxidized film105aformed by the irradiation of the first laser light is removed. After that, an inert gas with an oxygen density of 10 ppm or below is blown thereto, and, at the same time, second laser light is irradiated thereto (the energy density is higher than that of the irradiation of the first laser light). Thus, the surface of the semiconductor film102bis flattened, and a semiconductor film102chaving fewer depressions and projections on the surface can be obtained.

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