Method and apparatus for drying semiconductor wafer surfaces...

Details Method and apparatus for drying semiconductor wafer surfaces... Method and apparatus for drying semiconductor wafer surfaces...

2007-06-26

2007-06-26

Perrin, Joseph L. (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

C134S099100, C134S902000, C034S407000

Reexamination Certificate

active

10261839

ABSTRACT:
One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously.

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