Lead frame package structure with high density of lead pins...

Details Lead frame package structure with high density of lead pins... Lead frame package structure with high density of lead pins...

2007-08-14

2007-08-14

Lee, Hsien-Ming (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S672000, C257S676000, C257S692000

Reexamination Certificate

active

11164823

ABSTRACT:
A lead frame package structure with high density of lead pins arrangement is formed. The lead frame structure includes a die, a plurality of first lead pins and a plurality of second lead pins, wherein the first lead pins and the second lead pins are positioned on at least one side of the die, and are electrically connected to the die. The first lead pins and the second lead pins are selected from a group consisting of J-leads, L-leads and I-leads, and terminals of the first lead pins and terminals of the second lead pins are staggered so that the high density of lead pins arrangement is formed without risking a short circuit.

REFERENCES:
patent: 6777785 (2004-08-01), Shyu

Affiliated with

Also associated with

Rating

Lead frame package structure with high density of lead pins... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame package structure with high density of lead pins..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame package structure with high density of lead pins... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3838401