Method of manufacturing

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S795000, C257SE21411

Reexamination Certificate

active

10330015

ABSTRACT:
A method of efficiently forming a circuit using a thin film transistor with a semiconductor layer in which preferable crystallinity is obtained is provided. A location on which stress concentrates according to crystallization of a semiconductor layer formed on a substrate having unevenness corresponds to the edges and their vicinities of the unevenness provided on the substrate, that is, the boundary between a concave portion and a convex portion and its vicinities. Thus, the location in which stress concentration is caused can be specified and controlled according to the shape of a slit-shaped base layer. In addition, an island-like semiconductor layer (1305) which becomes the active layer of a TFT is formed on the concave portion or the convex portion of the substrate having the unevenness. At this time, at least a portion which becomes the channel formation region of the TFT is formed without crossing the boundary between the concave portion and the convex portion. Such TFTs are used in parallel to construct a TFT having a large channel width so that fluctuation in electrical characteristics is averaged.

REFERENCES:
patent: 4330363 (1982-05-01), Biegesen et al.
patent: 4710604 (1987-12-01), Shirasu et al.
patent: 5097297 (1992-03-01), Nakazawa
patent: 5145808 (1992-09-01), Sameshima et al.
patent: 5163220 (1992-11-01), Zeto et al.
patent: 5578897 (1996-11-01), Nomura et al.
patent: 5589406 (1996-12-01), Kato et al.
patent: 5594296 (1997-01-01), Mitsutake et al.
patent: 5636042 (1997-06-01), Nakamura et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5659329 (1997-08-01), Yamanobe et al.
patent: 5731613 (1998-03-01), Yamazaki et al.
patent: 5759879 (1998-06-01), Iwasaki
patent: 5776803 (1998-07-01), Young
patent: 5841097 (1998-11-01), Esaka et al.
patent: 5847780 (1998-12-01), Kim et al.
patent: 5851862 (1998-12-01), Ohtani et al.
patent: 5854803 (1998-12-01), Yamazaki et al.
patent: 5858823 (1999-01-01), Yamazaki et al.
patent: 5932893 (1999-08-01), Miyanaga et al.
patent: 5953597 (1999-09-01), Kusumoto et al.
patent: 5959313 (1999-09-01), Yamazaki et al.
patent: 5965915 (1999-10-01), Yamazaki et al.
patent: 5970368 (1999-10-01), Sasaki et al.
patent: 5981974 (1999-11-01), Makita
patent: 5986306 (1999-11-01), Nakajima et al.
patent: 5994174 (1999-11-01), Carey et al.
patent: 6133583 (2000-10-01), Ohtani et al.
patent: 6162667 (2000-12-01), Funai et al.
patent: 6184559 (2001-02-01), Hayakawa et al.
patent: 6210996 (2001-04-01), Yamazaki et al.
patent: 6283813 (2001-09-01), Kaneko et al.
patent: 6288414 (2001-09-01), Ahn
patent: 6291320 (2001-09-01), Yamazaki et al.
patent: 6307214 (2001-10-01), Ohtani et al.
patent: 6337259 (2002-01-01), Ueda et al.
patent: 6355940 (2002-03-01), Koga et al.
patent: 6365933 (2002-04-01), Yamazaki et al.
patent: 6372562 (2002-04-01), Matsumoto
patent: 6387779 (2002-05-01), Yi et al.
patent: 6388386 (2002-05-01), Kunii et al.
patent: 6410368 (2002-06-01), Kawasaki et al.
patent: 6424331 (2002-07-01), Ozawa
patent: 6429100 (2002-08-01), Yoneda
patent: 6455360 (2002-09-01), Miyasaka
patent: 6475840 (2002-11-01), Miyanaga et al.
patent: 6482721 (2002-11-01), Lee
patent: 6492659 (2002-12-01), Yamazaki et al.
patent: 6555875 (2003-04-01), Kawasaki et al.
patent: 6566179 (2003-05-01), Murley et al.
patent: 6583440 (2003-06-01), Yasukawa
patent: 6602744 (2003-08-01), Ino et al.
patent: 6602758 (2003-08-01), Kizilyalli et al.
patent: 6632696 (2003-10-01), Kimura et al.
patent: 6642569 (2003-11-01), Mori et al.
patent: 6653212 (2003-11-01), Yamanaka et al.
patent: 6700133 (2004-03-01), Ohtani et al.
patent: 6727122 (2004-04-01), Seo et al.
patent: 6759628 (2004-07-01), Ino et al.
patent: 6812491 (2004-11-01), Kato et al.
patent: 6841434 (2005-01-01), Miyairi et al.
patent: 6841797 (2005-01-01), Isobe et al.
patent: 6847050 (2005-01-01), Yamazaki et al.
patent: 6861614 (2005-03-01), Tanabe et al.
patent: 6862008 (2005-03-01), Yamazaki et al.
patent: 6875998 (2005-04-01), Kato et al.
patent: 6884668 (2005-04-01), Yamazaki et al.
patent: 6888182 (2005-05-01), Mitani et al.
patent: 6906343 (2005-06-01), Yamazaki
patent: 6933527 (2005-08-01), Isobe et al.
patent: 2001/0000243 (2001-04-01), Sugano et al.
patent: 2001/0000627 (2001-05-01), Hayakawa et al.
patent: 2001/0035526 (2001-11-01), Yamazaki et al.
patent: 2002/0004292 (2002-01-01), Yamazaki et al.
patent: 2002/0036927 (2002-03-01), Mori et al.
patent: 2002/0048864 (2002-04-01), Yamazaki et al.
patent: 2002/0075208 (2002-06-01), Bae et al.
patent: 2002/0096680 (2002-07-01), Sugano et al.
patent: 2002/0098628 (2002-07-01), Hamada et al.
patent: 2002/0119609 (2002-08-01), Hatano et al.
patent: 2002/0121665 (2002-09-01), Kawasaki et al.
patent: 2002/0134981 (2002-09-01), Nakamura et al.
patent: 2003/0001800 (2003-01-01), Nakajima et al.
patent: 2003/0128200 (2003-07-01), Yumoto
patent: 2003/0141505 (2003-07-01), Isobe et al.
patent: 2003/0141521 (2003-07-01), Isobe et al.
patent: 2003/0183854 (2003-10-01), Kato et al.
patent: 2003/0183875 (2003-10-01), Isobe et al.
patent: 2003/0186490 (2003-10-01), Kato et al.
patent: 2003/0209710 (2003-11-01), Yamazaki et al.
patent: 2003/0209737 (2003-11-01), Mitani et al.
patent: 2003/0218169 (2003-11-01), Isobe et al.
patent: 2003/0218170 (2003-11-01), Yamazaki et al.
patent: 2003/0218171 (2003-11-01), Isobe et al.
patent: 2003/0218177 (2003-11-01), Yamazaki
patent: 2003/0219935 (2003-11-01), Miyairi et al.
patent: 2003/0230749 (2003-12-01), Isobe et al.
patent: 2003/0230750 (2003-12-01), Koyama et al.
patent: 2004/0016958 (2004-01-01), Kato et al.
patent: 2004/0016967 (2004-01-01), Yamazaki et al.
patent: 2004/0026696 (2004-02-01), Yamazaki et al.
patent: 2005/0020096 (2005-01-01), Miyairi et al.
patent: 2005/0029518 (2005-02-01), Kato et al.
patent: 2005/0029519 (2005-02-01), Yamazaki et al.
patent: 2005/0041005 (2005-02-01), Yamazaki et al.
patent: 2005/0098784 (2005-05-01), Isobe et al.
patent: 1 049 144 (2000-11-01), None
patent: 1 067 593 (2001-01-01), None
patent: 57-157519 (1982-09-01), None
patent: 58-151042 (1983-09-01), None
patent: 59-099713 (1984-06-01), None
patent: 59-125663 (1984-07-01), None
patent: 62-104117 (1987-05-01), None
patent: 63-031108 (1988-02-01), None
patent: 06-349735 (1994-12-01), None
patent: 07-130652 (1995-05-01), None
patent: 08-070129 (1996-03-01), None
patent: 08-078329 (1996-03-01), None
patent: 08-195357 (1996-07-01), None
patent: 08-288515 (1996-11-01), None
patent: 10-012891 (1998-01-01), None
patent: 10-135468 (1998-05-01), None
patent: 10-135469 (1998-05-01), None
patent: 11-084418 (1999-03-01), None
patent: 11-354442 (1999-12-01), None
patent: 2000-68520 (2000-03-01), None
patent: 2000-349296 (2000-12-01), None
patent: 2001-011085 (2001-01-01), None
patent: 2001-144027 (2001-05-01), None
patent: 2001-196599 (2001-07-01), None
patent: 2001-319877 (2001-11-01), None
patent: 2002-014337 (2002-01-01), None
patent: 2002-313811 (2002-10-01), None
patent: 2002-324808 (2002-11-01), None
patent: WO 00/63956 (2000-10-01), None
Geis et al., “Crystalline Silicon on Insulators by Graphoepitaxy,” IEEE 1979, pp. 210-212.
Geis et al., “Grapho-epitaxy of Silicon on Fused Silica Using Surface Micropatterns and Laser Crystallization,” J. Vac. Sci. Tech., 16(6), Nov./Dec. 1979, pp. 1640-1643.
Specification, claims, abstract and drawings of U.S. Appl. No. 09/344,646 filed Jun. 17, 1999 entitledSemicondctor Device and Fabrication Method Thereof.
H.W. Lam et al.,Characteristics of MOSFETS Fabricated in Laser-Recrystallized Polysilicon Islands With a Retaining Wall Structure on an Insulating Substrate, IEEE Electron Device Letters, vol. EDL-1, No. 10, Oct. 1980, pp. 206-208.
H.I. Smith et al.,Oriented Crystal Growth on Amorphous Substrates Using Artificial Surface-Relief Gratings, Appl. Phys. Lett., vol. 32, No. 6, Mar. 15, 1978, pp. 349-350.
D.K. Biegelsen et al.,Laser-Induced Crystallization of Silicon Islands on Amorphous Substrates: Multilayer Structures, Appl. Phys. Lett., vol. 38, No. 3, Feb. 1, 1981, pp. 150-152.
A. Hara et al.,Ultra-High Performance Poly-Si TFTs on a Glass by a Stable Scanning CW Laser

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