Method for producing an optoelectronic component

Details Method for producing an optoelectronic component Method for producing an optoelectronic component

2007-02-20

2007-02-20

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S116000, C257S013000, C257S021000, C257S079000, C257S294000, C257S678000, C257S787000, C257S794000

Reexamination Certificate

active

10695580

ABSTRACT:
An optoelectronic component with an optoelectronic transducer is produced with the novel method. The optoelectronic component has a coupling region, which is formed in a radiation-transparent molding of the optoelectronic component. On the base of a clearance of the coupling region, the optoelectronic component has a radiation-optical functional surface, which is formed from the housing material and introduced into the molding with the aid of a profile milling cutter.

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English translation of previously filed Japanese Utility Model JP 59-91764, dated Jun. 21, 1984.

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