Method of forming wiring

Details Method of forming wiring Method of forming wiring

2007-02-20

2007-02-20

Lee, Hsien-Ming (Department: 2823)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

On insulating substrate or layer

C438S640000, C438S662000

Reexamination Certificate

active

11372561

ABSTRACT:
A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating layer is irradiated with a laser beam with the focus position staggered.

REFERENCES:
patent: 4965430 (1990-10-01), Curtis et al.
patent: 6631558 (2003-10-01), Burgess
patent: 6710260 (2004-03-01), Seki et al.
patent: 6984542 (2006-01-01), Yanagisawa et al.
patent: 2003/0007332 (2003-01-01), Seki et al.

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