Interconnection element for BGA housings and method for...

Details Interconnection element for BGA housings and method for... Interconnection element for BGA housings and method for...

2007-05-22

2007-05-22

Smith, Matthew S. (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S629000

Reexamination Certificate

active

10944684

ABSTRACT:
An electronic component includes an interposer substrate and at least one semiconductor chip mounted on the interposer substrate. A plurality of electrical connections electrically couple a rewiring of the interposer substrate to contact regions of the at least one semiconductor chip. A plurality of connection elements are positioned for electrical contact-connection with a printed circuit board. The interconnection elements comprise hollow-cylindrical or rod-shaped elements that penetrate through and are fixedly connected to the interposer substrate.

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