Semiconductor wafer, semiconductor device, method for...

Details Semiconductor wafer, semiconductor device, method for... Semiconductor wafer, semiconductor device, method for...

2007-02-13

2007-02-13

Menz, Doug (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S678000

Reexamination Certificate

active

10803192

ABSTRACT:
A semiconductor wafer includes a semiconductor substrate having a plurality of integrated circuits and electrical interconnections electrically connected to each of the integrated circuits. The semiconductor substrate includes bonding pads formed on a surface of the semiconductor substrate. Each of the bonding pads is part of a corresponding electrical interconnection. First resin layers are each disposed on each of a plurality of areas on the semiconductor substrate and have ridged edges. Wirings are each disposed over a corresponding bonding pad and a corresponding first resin layer and are electrically connected to the corresponding bonding pad. External connection terminals are each disposed on a corresponding wiring and are electrically connected to the corresponding wiring.

REFERENCES:
patent: 5371411 (1994-12-01), Hara et al.
patent: 6323542 (2001-11-01), Hashimoto
patent: 2002-093947 (2002-03-01), None

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