Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-02-06
2007-02-06
Patel, Paresh (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S754090, C324S1540PB
Reexamination Certificate
active
10340558
ABSTRACT:
In accordance with an embodiment of the present invention, a semiconductor wafer has a plurality of dies each having a circuit and a plurality of contact pads. The plurality of contact pads include a first contact pad to receive a power supply voltage, a second contact pad to receive a ground voltage, and a third contact pad to receive a test control signal. The third contact pad is connected to a programmable self-test engine (PSTE) embedded on the corresponding die so that the test control signal activates the PSTE to initiate a self-test. A probe card has a plurality of sets of probe pins, each set of probe pins having three probe pins for contacting the first, second, and third contact pads of one of a corresponding number of the plurality of dies. During wafer test, the plurality of sets of probe pins come in contact with a corresponding number of dies so that the self-test is carried out simultaneously in the corresponding number of dies.
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Park Eungjoon
Pourkeramati Ali
Patel Paresh
Townsend and Townsend / and Crew LLP
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