Microelectronic mechanical system and methods

Details Microelectronic mechanical system and methods Microelectronic mechanical system and methods

2007-02-27

2007-02-27

Trinh, Michael (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With desiccant, getter, or gas filling

C257S678000, C257S680000

Reexamination Certificate

active

11129541

ABSTRACT:
The current invention provides for encapsulated release structures, intermediates thereof and methods for their fabrication. The multi-layer structure has a capping layer, that preferably comprises silicon oxide and/or silicon nitride, and which is formed over an etch resistant substrate. A patterned device layer, preferably comprising silicon nitride, is embedded in a sacrificial material, preferably comprising polysilicon, and is disposed between the etch resistant substrate and the capping layer. Access trenches or holes are formed in to capping layer and the sacrificial material are selectively etched through the access trenches, such that portions of the device layer are release from sacrificial material. The etchant preferably comprises a noble gas fluoride NGF2x(wherein Ng=Xe, Kr or Ar: and where x=1, 2 or 3). After etching that sacrificial material, the access trenches are sealed to encapsulate released portions the device layer between the etch resistant substrate and the capping layer. The current invention is particularly useful for fabricating MEMS devices, multiple cavity devices and devices with multiple release features.

REFERENCES:
patent: 5025346 (1991-06-01), Tang et al.
patent: 5919548 (1999-07-01), Barron et al.
patent: 5963788 (1999-10-01), Barron et al.
patent: 6559070 (2003-05-01), Mandal
patent: 2002/0131228 (2002-09-01), Potter
patent: 2002/0131230 (2002-09-01), Potter
patent: WO 01/30715 (2001-05-01), None
EPO Search Report for EP Application No. 02 798 102.6 (1 sheet).

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