Printed circuit board for thermal dissipation and electronic...

Details Printed circuit board for thermal dissipation and electronic... Printed circuit board for thermal dissipation and electronic...

2007-11-20

2007-11-20

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S706000

Reexamination Certificate

active

11257593

ABSTRACT:
A printed circuit board (PCB) for a package substrate of a multi-package module (MPM). The PCB comprises a substrate and a heat sink thereon. The heat sink comprises a first portion under the package substrate of the MPM. The heat sink further comprises a second portion adjacent to the first portion, comprising at least one fin.

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Taiwan Office Action mailed Aug. 24, 2006.
China Office Action mailed Feb. 2, 2007.

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