Package with integrated inductor and/or capacitor

Details Package with integrated inductor and/or capacitor Package with integrated inductor and/or capacitor

2007-01-23

2007-01-23

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S109000, C438S110000, C438S598000, C257S777000, C257S778000, C257S780000

Reexamination Certificate

active

10811572

ABSTRACT:
Methods for attaching two wafers are presented along with devices resulting from such methods. In one illustrative embodiment, a first wafer is provided having pillars for conducting an electric signal. The wafer also includes an electronic device such as an inductor or capacitor that may in some instances consume relatively large amounts of space. The first wafer is bonded to a second wafer so that a circuit on the second wafer may be electrically connected to the electronic device of the first wafer.

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