System, method and program product for positioning I/O pads...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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Details

C716S030000, C716S030000, C716S030000, C703S016000

Reexamination Certificate

active

10602369

ABSTRACT:
Under the present invention, a proposed placement of I/O pads into one or more groups on a chip analyzed. Specifically, using resources such as a control file, cross-reference table, an I/O limit table, and an optional information file, a group switching current for each proposed I/O pad group is automatically calculated and compared to predetermined maximum switching current(s). If an I/O pad group exhibits a switching current that exceeds its predetermined maximum, corrective action is taken. Such action can include, for example, relocation of an I/O pad from an overloaded I/O pad group to another I/O pad group, insertion of an additional power pad into the overloaded I/O pad group, etc.

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G. Yasar et al., “I/O Cell Placement and Electrical Checking Methodology for ASICs with Peripheral I/Os”, IEEE 2001, Quality Electronic Design, 2001 International Symposium on□□ Mar. 26-28, 2001 pp. 71-75.

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