Method of manufacturing high performance copper inductors...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C438S612000, C438S613000, C438S652000, C336S200000

Reexamination Certificate

active

10707896

ABSTRACT:
A method for manufacturing high performance copper inductors includes providing a tall, Cu laminate spiral inductor is formed at the last metal level, and at the last metal +1 level, with the metal levels being interconnected by a bar via having the same spiral shape as the spiral metal inductors at the last metal level and the last metal +1 level. The method includes integrating the formation of thick inductors with the formation of bond pads, terminals and interconnect wiring with the last metal +1 wiring. Included are dielectric deposition and spacer formation steps, and/or selective deposition of a passivating metal such as CoWP, to passivate a Cu inductor that is formed after the last metal layer.

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patent: 5695810 (1997-12-01), Dubin et al.
patent: 6153935 (2000-11-01), Edelstein et al.
patent: 6259160 (2001-07-01), Lopatin et al.
patent: 6730982 (2004-05-01), Barth et al.
patent: 2002/0197844 (2002-12-01), Johnson et al.
patent: 5-347212 (1993-12-01), None
patent: 2002-118111 (2002-04-01), None

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