Electronic packages with dice landed on wire bonds

Details Electronic packages with dice landed on wire bonds Electronic packages with dice landed on wire bonds

2007-01-23

2007-01-23

Malsawma, Lex H. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

Reexamination Certificate

active

10921014

ABSTRACT:
A stacked dice electronic package without spacers between the dice and where an overlying die is landed on wire bonds of the underlying die is disclosed.

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J. Robert Lineback, Tessera—with Intel—introduces ‘folded’ stacked -chip packages, webpage located at www.siliconstrategies.com/article, 2 pages, May 2004.
Author unknown, Wire Bonded Stacked Chips, webpage located at www.eleceng.adelaide.edu.au/Personal/alsarawi
ode35.html, 2 pages, May 2004.

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